Semiconductor process modeling to enable skip via in  place and route flow

ABSTRACT

A method is presented for incorporating skip vias in a place and route flow of an integrated circuit design. The method includes employing a place and route tool to add the skip vias, each skip via extending through a metallization layer to electrically connect a metal layer above the metallization layer to a metal layer below the metallization layer and, when a violation of a design rule is detected due to the addition of one or more of the skip vias, substituting skip vias that violate the design rule with a standard via.

BACKGROUND Technical Field

The present invention relates generally to semiconductor physical designgeneration and more specifically, to incorporating skip vias in placeand route flows of electronic design automation (EDA) tools.

Description of the Related Art

As technology nodes for integrated circuits get smaller, different partsof the design can pose challenges for integrated circuit (IC) designers.For example, wire delays can dominate cell delays in designs that useprocess technologies at 10 nm and below. Wire delay mis-correlation canbe due to routing topologies, such as high fan-out or congested areas ofthe design. Further, delay caused by via resistance can become animportant issue for the 7 nm technology node and below. Currently, it isdifficult to predict how many vias and what kind of vias will be usedearly in the design development. Yet further, lower metal layers canhave 20-40 times per unit length resistance compared to higher metallayers at the 10 nm technology node and below. As a result, long nets inupper layers can have pessimistic delay estimations and short nets inlower layers can have optimistic delay estimations.

SUMMARY

In accordance with an embodiment, a method is provided for incorporatingskip vias in a place and route flow of an integrated circuit design. Themethod includes employing a place and route tool to add the skip vias,each skip via extending through a metallization layer to electricallyconnect a metal layer above the metallization layer to a metal layerbelow the metallization layer and, when a violation of a design rule isdetected due to the addition of one or more of the skip vias,substituting skip vias that violate the design rule with a standard via.

In accordance with another embodiment, a method is provided forincorporating skip vias in a place and route flow of an integratedcircuit design. The method includes placing cells by employing a placeand route tool, selecting first metal layer pin access points for eachfirst metal layer shape, adding a skip via over the first metal layer,adding a third metal layer over the skip via, the third metal layerconnected to the first metal layer, determining whether a violation of adesign rule is triggered due to the addition of the skip via, and, ifthe violation of the design rule is confirmed, substituting the skip viawith a standard via.

In accordance with yet another embodiment, a method is provided forincorporating skip vias in a place and route flow of an integratedcircuit design. The method includes placing cells by employing a placeand route tool, creating a first metal layer pin connection list,determining whether a skip via can land on one or more first metal layerpins, if confirmed that the skip via can land on the one or more firstmetal layer pins, determining whether the first metal layer pins arefrom different cells, and, if the first metal layer pins are fromdifferent cells, adding a skip via.

It should be noted that the exemplary embodiments are described withreference to different subject-matters. In particular, some embodimentsare described with reference to method type claims whereas otherembodiments have been described with reference to apparatus type claims.However, a person skilled in the art will gather from the above and thefollowing description that, unless otherwise notified, in addition toany combination of features belonging to one type of subject-matter,also any combination between features relating to differentsubject-matters, in particular, between features of the method typeclaims, and features of the apparatus type claims, is considered as tobe described within this document.

These and other features and advantages will become apparent from thefollowing detailed description of illustrative embodiments thereof,which is to be read in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The invention will provide details in the following description ofpreferred embodiments with reference to the following figures wherein:

FIG. 1 is a cross-sectional view of a semiconductor structure includinga skip via, in accordance with an embodiment of the present invention;

FIG. 2 is a block/flow diagram illustrating a simplified representationof an exemplary digital integrated circuit (IC) flow, in accordance withan embodiment of the present invention;

FIG. 3 is a block/flow diagram illustrating an electronic designautomation (EDA) software design process, in accordance with anembodiment of the present invention;

FIG. 4 is a block/flow diagram illustrating a place and route (PnR)flow, in accordance with an embodiment of the present invention;

FIG. 5 is a block/flow diagram illustrating a PnR flow enabling one ormore skip vias in a first methodology, in accordance with an embodimentof the present invention;

FIG. 6 is a block/flow diagram illustrating a PnR flow enabling one ormore skip vias in a second methodology, in accordance with an embodimentof the present invention;

FIG. 7 is a block/flow diagram illustrating a PnR flow when a violationof a design rule is detected, in accordance with an embodiment of thepresent invention;

FIG. 8 is an exemplary processing system for enabling the insertion ofone or more skip vias, in accordance with embodiments of the presentinvention; and

FIG. 9 is a block/flow diagram of an exemplary system network whereusers access electronic design automation (EDA) tools to place one ormore skip vias, in accordance with embodiments of the present invention.

Throughout the drawings, same or similar reference numerals representthe same or similar elements.

DETAILED DESCRIPTION

Electronic design automation (EDA) tools can be advantageously employedto optimize integrated circuit design during placement and routingstages. In general, optimization performed during actual routingattempts to eliminate design rule violations, and, therefore, tends toneed more iterations and a longer runtime compared to estimated routingperformed during placement.

Embodiments in accordance with the present invention provide methods anddevices for designing an electronic circuit with EDA tools includingskip via (or super via) features, which, in turn, necessitate redefineddesign rules. The redefined design rules pertain to vias formed within asemiconductor structure. Design of an electronic circuit, for example,an integrated circuit (IC), is a complicated and time consuming process.Generally, a design flow commences with defining the designspecifications or requirements. The requirements of the design areimplemented, for example, as a netlist or electronic circuitdescription. The implementation can be performed by, for example,schematic capture (drawing the design with a computer aided designtool). The implemented design is simulated to verify design accuracy.Design implementation and simulation are iterative processes. Forexample, errors found by simulation are corrected by designimplementation and re-simulated.

Once the design is verified for accuracy with simulation, a physicallayout of the design is created. The physical layout describes thedetailed design geometries and the relative positioning of each designlayer to be employed in actual fabrication. The design layout is verytightly linked to overall circuit performance (e.g., area, speed, andpower dissipation) because the physical structure defined by the designlayout determines, for example, the parasitic capacitances andresistances, and the silicon area which is employed to realize a certainfunction. The detailed design layout can be a very intensive andtime-consuming design effort and is usually performed utilizingspecialized computer aided design (CAD) or Electronic Design Automation(EDA) tools.

The design layout is checked against a set of design rules in a designrule check (DRC). The created design layout must conform to a complexset of design rules in order, for example, to ensure a lower probabilityof fabrication defects. The design rules specify, for example, how farapart the geometries, on same or different layers, must be, or how largeor small various aspects of the layout must be for successfulfabrication, given the tolerances and other limitations of thefabrication process. A design rule can be, for example, determining viarules. DRC is a time-consuming iterative process that needs manualmanipulation and interaction by the designer. The designer performsdesign layout and DRC iteratively, reshaping and moving designgeometries to correct all layout errors and achieve a DRC clean(violation free) design.

In semiconductor design technology, many metal layers are employed toimplement interconnections throughout an integrated circuit. For someintegrated circuits, one or more polysilicon (poly) layers, or evenactive areas, are also used to implement interconnections. Vias areemployed to connect from one such metal or polysilicon layer to anothermetal or polysilicon layer. For example, a via can be used to connect afeature (e.g., a design geometry) on each of two metal layers. The lowerone of the two layers is referred to as the landing metal layer and theupper one of the two layers is referred to as the covering layer. A viabetween a landing metal layer mt_(x) and the covering metal layermt_(x+1) is usually referred to as a v_(x) via (e.g., using the samesubscript designation as the landing metal layer).

Embodiments in accordance with the present invention provide methods anddevices for incorporating skip vias (or super vias) in a place and routeflow of an integrated circuit design. A method for enabling skip vias indesign flow is introduced that maintains or controls process risks whilemaximizing performance gains. The method enables skip vias in automatedplace and route design automation, enables automated design flow withcontrolled process risks, enables automated design flow with maximizedresistance-capacitance (RC) performance gain, and further enablesautomated design flow with balanced RC load among two metal layers(e.g., metal layer or level that skip via skips and metal layer or levelthat skip via connects).

It is to be understood that the present invention will be described interms of a given illustrative architecture; however, otherarchitectures, structures, substrate materials and process features andsteps/blocks can be varied within the scope of the present invention. Itshould be noted that certain features cannot be shown in all figures forthe sake of clarity. This is not intended to be interpreted as alimitation of any particular embodiment, or illustration, or scope ofthe claims.

FIG. 1 is a cross-sectional view of a semiconductor structure includinga skip via, in accordance with an embodiment of the present invention.

Structure 1 can include a first metallization layer 2 and a standard via4 connecting the first metallization layer 2 to a second metallizationlayer 6. The second metallization layer 6 can be connected to a thirdmetallization layer 10 by employing another standard via 8. In structure1, the standard vias 4, 8 can be misaligned or offset from each other.

Similarly, structure 11 can include a first metallization layer 12 and astandard via 14 connecting the first metallization layer 12 to a secondmetallization layer 16. The second metallization layer 16 can beconnected to a third metallization layer 20 by employing anotherstandard via 18. In structure 11, the standard vias 14, 18 can bealigned.

In structures 1, 11, the standard vias 4, 8, 14, 18 can be replaced witha skip via structure 30. Structure 30 shows a skip via 36 employed toconnect the first metallization layer 32 to the third metallizationlayer 34. The structure 30 enables the reduction ofresistance-capacitance and further eliminates Mx minimum area.

The skip via structures of the present invention can be manufactured ina number of ways using a number of different tools. In general, though,the methodologies and tools are employed to form structures withdimensions in the micrometer and nanometer scale. The methodologies,e.g., technologies, employed to manufacture the skip via structures ofthe present disclosure have been adopted from IC technology. Forexample, the structures are built on wafers and are realized in films ofmaterial patterned by photolithographic processes on the top of a wafer.In particular, the fabrication of the skip via structures uses threebasic building blocks: (i) deposition of thin films of material on asubstrate, (ii) applying a patterned mask on top of the films byphotolithographic imaging, and (iii) etching the films selectively tothe mask.

FIG. 2 is a block/flow diagram illustrating a simplified representationof an exemplary digital integrated circuit (IC) flow, in accordance withan embodiment of the present invention.

At a high level, the process 40 starts with the product idea 42 and isrealized in an EDA software design process 44. When the design isfinalized, it can be taped-out 46. After tape out, the fabricationprocess 48 and packaging and assembly processes 50 occur resulting,ultimately, in finished chips 52.

FIG. 3 is a block/flow diagram illustrating an electronic designautomation (EDA) software design process, in accordance with anembodiment of the present invention.

The EDA software design process 44 includes a number of steps/blocks62-80, shown in linear fashion for simplicity. In an actual IC designprocess, the particular design might have to go back through steps untilcertain tests are passed. Similarly, in any actual design process, thesesteps can occur in different orders and combinations. This descriptionis therefore provided by way of context and general explanation ratherthan as a specific, or recommended, design flow for a particular IC.

A brief description of the components steps/blocks of the EDA softwaredesign process 44 will now be provided.

Concerning system design 62, the designers describe the functionality tobe implemented, and the designers can perform what-if planning to refinefunctionality, check costs, etc. Hardware-software architecturepartitioning can occur at this stage.

Concerning logic design and functional verification 64, the VHSICHardware Description Language (VHDL) or Verilog code for modules in thesystem is written and the design is checked for functional effort. Morespecifically, it is determined whether the design as checked ensuresthat the correct outputs are produced.

Concerning synthesis and design for test 66, the VHDL/Verilog istranslated to a netlist. The netlist can be optimized for the targettechnology. Additionally, the design and implementation of tests topermit checking of the finished chip occurs.

Concerning netlist verification 68, the netlist is checked forcompliance with timing constraints and for correspondence with theVHDL/Verilog source code.

Concerning design planning 70, an overall floorplan for the chip isconstructed and analyzed for timing and top-level routing.

Concerning physical implementation 72, the placement (positioning ofcircuit elements) and routing (connection of the same) occurs at thisblock. In one embodiment, the pattern-based RC scaling technique can beperformed by the IC Compiler tool. The pattern-based RC scalingtechnique can advantageously use lower-effort routing results fromactual routing to define and/or refine pattern-based RC scaling at theplacement stage. The IC Compiler tool can perform both virtual routing,which is done at the placement stage, and actual routing of anintegrated circuit design.

Concerning analysis and extraction 74, the circuit function is verifiedat a transistor level, which in turn permits what-if refinement.

Concerning physical verification 76, various checking functions areperformed to ensure correctness for manufacturing, electrical issues,lithographic issues, and circuitry.

Concerning resolution enhancement 78, this process involves geometricmanipulations of the layout to improve manufacturability of the design.

Concerning mask data preparation 80, this process provides the“tape-out” data for production of masks for lithographic use to producefinished chips.

FIG. 4 is a block/flow diagram illustrating a place and route (PnR) flow100, in accordance with an embodiment of the present invention.

At block 102, a netlist can be created by a designer. A netlist is adescription of the connectivity of an electronic circuit. In itssimplest form, a netlist includes a list of the electronic components ina circuit and a list of the nodes they are connected to. Netlistsusually provide nothing more than instances, nodes, and perhaps someattributes of the components involved.

At block 104, a library cell design can also be created by a designer. Astandard cell library is a collection of low-level electronic logicfunctions such as AND, OR, INVERT, flip-flops, latches, and buffers.These cells are realized as fixed-height, variable-width full-customcells. The key aspect with these libraries is that they are of a fixedheight, which enables them to be placed in rows, easing the process ofautomated digital layout. The cells are optimized full-custom layouts,which minimize delays and area. A standard-cell library can include,e.g., two main components: (1) a library database, which includes anumber of views often including layout, schematic, symbol, abstract, andother logical or simulation views. From this, various information can becaptured in a number of formats, which include reduced information aboutthe cell layouts, sufficient for automated “place and route” tools, and(2) a timing abstract to provide functional definitions, timing, power,and noise information for each cell.

A standard-cell library can also include the following additionalcomponents: a full layout of the cells, Spice models of the cells,Verilog models or VHDL-VITAL models, parasitic extraction models, anddesign rule checking (DRC) rule decks.

At block 106, the netlist design 102 and the library cell design 104 areemployed for cell placement 106. The cell is a circuit that has beenpre-designed and pre-verified as a building block. In a standard celldesign, each distinct cell in a library can have unique geometries ofactive, gate, and metal levels. With gate arrays, however, each cellshares the same building block, called a core cell that includes fixedactive and gate level geometries. Different gate array cells areimplemented using only metal interconnections between the active andgate elements of one or more core cells. Examples of a standard cell orgate array cell include an inverter, a NAND gate, a NOR gate, a flipflop, and other similar logic circuits.

During the process of designing an integrated circuit, a designer canselect particular cells from a library of cells and use them in adesign. The library includes cells that have been designed for a givenIC manufacturing process, such as complementary metal oxidesemiconductor (CMOS) fabrication. The cells generally have a fixedheight but a variable width, which enables the cells to be placed inrows. Cells do not change from one design to the next, but the way inwhich they are interconnected will, to achieve the desired function in agiven design. By being able to select the cells from the library for usein the design, the designer can quickly implement a desiredfunctionality without having to custom design the entire integratedcircuit from scratch.

Cells are normally designed so that routing connections between cellscan be made efficiently. Routing in an IC design is accomplished throughrouting elements, such as wires in one or more metal layers. Each metallayer is separated from other metal layers by insulating layers, andvias connect one metal layer to another. These routing elements performat least two functions: they connect individual transistors that make upa standard cell, and they connect cells to each other globally (e.g., ona chip-level) to implement the desired functionality of the integratedcircuit. For example, clock signals, reset signals, test signals, andsupply voltages can be carried through these routing elements.

At block 108, a pin access list can be created. The access list can be afirst metallization layer (M1) access list. A standard cell includescell pins that are offset from the edges of the cell based on thelocations of the routing tracks relative to the cell boundaries. Thecell pins can be wider than minimum metal width wires routed along therouting tracks. By configuring the pins of a standard cell in thismanner, the standard cell can be arranged in a layout in its normalorientation, or flipped about its axis. In both orientations, the cellpins still maintain proper alignment with minimum width wires placedalong the routing tracks.

A cell described herein refers to a predefined circuit unit or circuitelement that is provided, as part of a cell library of many differenttypes of circuit units, to an integrated circuit designer and the cellis re-used in multiple instances as needed to make up the integratedcircuit. For example, a cell may be an inverter, a NAND gate, a NORgate, a flip flop, and other similar logic circuits. Each cell has aboundary, usually including four edges that form a rectangular shape. Asused herein, a standard cell refers to a cell with a predefined layoutthat is used in conjunction with other standard cells to implement adesired functionality of an integrated circuit. Standard cells can havefixed active and gate level geometries. Standard cells can have a fixedheight but variable width, which allows the standard cells to be placedside-by-side in rows.

A cell pin described herein refers to metal wires within a cell thatserve as connection points for external connections to a cell (e.g.,connections between one cell and another cell). Cell pins are sometimesreferred to as cell ports, although the term cell pin is meant toinclude both cell pins and cell ports. Cell pins can be input pins,which are the connection points for the input signals of a standardcell. Cell pins can be output pins, which are connection points for theoutput signals of a standard cell. The locations of the pins aredesignated by the designer of the standard cell when creating the cell.

At block 110, an M1 pin access point is selected for each M1 shape. Cellpins are often routed on a lower metal layer, such as a metal one (M1)layer or a metal two (M2) layer. The cell pins are placed in the M1layer and can be configured to be wider than a minimum metal widthspecified by design rules.

At block 112, a first via V1 can be added. The via V1 can connecttogether the metal wires of the different M1 and M2 layers. Routingtracks are reference lines that define the preferred center ofchip-level (e.g., cell to cell) routes created by the EDA software 44during physical implementation 72. The routes can be, for example, wiresand vias that connect the cell pins to each other. Routing along tracksallows for faster chip-level routing by the EDA software 44. Although itis possible for EDA software 44 to route off the tracks, this needs moreexecution time and memory. Thus, routing is more efficient when the cellpins are aligned with the routing tracks to avoid routing off track.Routing along tracks also creates regularity in the wire routing, whichdecreases routing congestion at the chip-level. Routing tracks can runvertically for vertical wires or horizontally for horizontal wires,resulting in a coarse grid of routing tracks. In one embodiment, routingtracks within a metal layer have a fixed pitch (e.g., distance betweenrouting tracks is fixed).

At block 114, an M2 layer can be added. The via V1 can connect metalslayers M1 and M2 at this stage. Integrated circuits layouts havemultiple metal layers for routing signals. The layer closest to thesubstrate is referred to as the metal 1 (“M1”) layer. Other metallayers, such as the metal 2 (“M2”) and metal 3 (“M3”) layers are furtherfrom the substrate. In one embodiment, metal layers are routed accordingto an alternating horizontal-vertical-horizontal (HVH) orvertical-horizontal-vertical (VHV) topology. In other words, all wires(and routing tracks) in a metal layer run predominantly in onedirection, and the wires in the adjacent metal layer run predominantlyin an orthogonal direction. For example, in the VHV routing topology,the wires in the M1 layer run vertically, the wires in the M2 layer runhorizontally, and the wires in the M3 layer run vertically. In anotherembodiment, metal layers are routed following HHV topology. In thistopology, M1 and M2 are predominantly horizontal, M3 is predominantlyvertical, and routing directions in subsequent layers alternate with M4horizontal, M5 vertical, and so on.

An integrated circuit layout must also comply with design rules. Designrules restrict the placement of objects in a layout to account forinevitable variations during the manufacturing process. There are threebasic types of objects in any physical design: line objects (e.g.,gates, metals), point objects (e.g., contacts, vias) and block objects(e.g., diffusions, implants). Modern layout designs are subject to manydesign rules that limit both the size of the objects and their proximityto other objects.

At block 116, it is determined whether the via V1 was successfullyplaced to connect the first metal layer M1 to the second metal layer M2.If NO, the process proceeds back to block 110. If YES, the processproceeds to block 118. In order to ensure a proper via connection to thecell pins, the EDA software 44 must align metal wires with the cellpins.

At block 118, an M2 pin access list is generated.

At block 120, an M2 pin access point is selected for each M2 shape.

At block 122, a second via V2 is added.

At block 124, an M3 layer can be added.

At block 126, it is determined whether the via V2 was successfullyplaced to connect the second metal layer M2 to the third metal layer M3.If NO, the process proceeds back to block 120. If YES, the processproceeds to block 128. In order to ensure a proper via connection to thecell pins, the EDA software 44 must align metal wires with the cellpins.

At block 128, the metallization process is complete. In other words, allthe metallization layers have been connected by one or more vias.

FIG. 5 is a block/flow diagram illustrating a PnR flow 200 enabling oneor more skip vias in a first methodology, in accordance with anembodiment of the present invention.

At block 202, a netlist design and/or a library cell design can beemployed for cell placement.

At block 204, a pin access list can be created. The access list can be afirst metallization layer (M1) access list.

At block 206, a skip via SV2 is added in a layer-by-layer fashion(V1→M2→V2→etc.). A skip via can be formed through many insulator layers,e.g., bypassing one or more wiring structures within the insulatorlayers, to connect with a lower wiring structure. This provides improvedresistance characteristics, minimizes capacitance for a lower wiringstructure, e.g., at M0 layer, as well as provides area efficiencies inthe chip manufacturing process. In the manufacturing process, the skipvia will need to land on a wiring structure in a lower level (e.g., M0level), while the regular via will need to land on the wiring structurein an upper level (e.g., M1 or above level).

The skip via SV2 is automatically added as a default.

At block 208, a metallization layer M3 is added to connect metal layerM1 to metal layer M3. Therefore, the skip via V2 skips connections tometal layer M2.

At block 210, it is determined whether the skip via V2 was successfullyplaced to connect the first metal layer M1 to the third metal layer M3.If YES, the process proceeds to block 230 where the skip via additionprocess is complete. If NO, the process proceeds to block 212. In orderto ensure a proper skip via connection to the cell pins, the EDAsoftware 44 must align metal wires with the cell pins.

At block 212, a list is generated of all the failed skip vias.

At block 214, if a failed skip via is detected, it is replaced with astandard via V1.

At block 216, a second metallization layer M2 is added to connect thestandard via V1 to the first metallization layer M1. The secondmetallization layer M2 is only added where a skip via failure occurs.The skip via failure can occur due to, e.g., a design rule violation.

At block 218, is determined whether the standard via V1 was successfullyplaced to connect the first metal layer M1 to the second metal layer M2.If NO, the process proceeds back to block 204. If YES, the processproceeds to block 220.

At block 220, an M2 pin access list is generated.

At block 222, an M2 pin access point is selected for each M2 shape.

At block 224, a second via V2 is added. V2 is a standard via.

At block 226, an M3 layer can be added.

At block 228, it is determined whether the via V2 was successfullyplaced to connect the second metal layer M2 to the third metal layer M3.If NO, the process proceeds back to block 222. If YES, the processproceeds to block 230 where the skip via addition process is complete.

Therefore, the PnR flow 200 of FIG. 5 automatically replaces all vias(standard vias) with a skip via. This process ensures that skip vias orsuper vias are employed as much as possible. If it is determined thatthe addition of the skip vias creates design rule violations, then alist of all the failed skip vias is created. The failed skip vias arethen replaced with standard vias. However, successfully placed skip viasremain intact or in place. The design rule violations can pertain to,e.g., the skip via not landing on minimum Mx−1, the skip via not landingon Mx−1 at minimum space, the skip via not dropping from minimum Mx+1,the skip via not dropping from Mx+1 at minimum space, and minimumdistance to existing skip via. Thus, the automatic addition of skip viasmust take into consideration design rules pertaining to at leastpermitted width rules and minimum space rules.

FIG. 6 is a block/flow diagram illustrating a PnR flow 300 enabling oneor more skip vias in a second methodology, in accordance with anembodiment of the present invention. In this exemplary embodiment, skipvia usage is less aggressive and only used for pins that are far apart.At the same time, this method attempts to maintain similar densitiesbetween metal layers.

At block 302, a netlist design and/or a library cell design can beemployed for cell placement.

At block 304, an M1 pin connection list is created.

At block 306, each pin connection is detected.

At block 308, it is determined whether a skip via SV can land on M1pins. It is noted that only SV2-M1 restrictions are considered. If NO,the process proceeds to block 314 where the regular PnR flow 100 isfollowed. If YES, the process proceeds to block 310.

At block 310, it is determined whether the pins from the cells areapart. In other words, it is determined whether the pins are fromdifferent cells. If YES, the process proceeds to block 316 where a skipvia V2 is added to connect to metal layer M3. If NO, the processproceeds to block 312.

At block 312, it is determined whether the M3 layer density is less thancertain ratio, say 60%, of the M2 layer density. If YES, the processproceeds to block 316 where a skip via V2 is added to connect to metallayer M3. By doing this, M2/M3 density can be balanced. If NO, theprocess proceeds to block 314 where the regular PnR flow 100 isfollowed.

Therefore, a method for enabling skip vias in design flow is introducedthat maintains or controls process risks while maximizing performancegains. The method enables skip vias in automated place and route designautomation, enables automated design flow with controlled process risks,enables automated design flow with maximized RC performance gain, andfurther enables automated design flow with balanced RC load among twometal layers (e.g., metal layer or level that skip via skips and metallayer or level that skip via connects).

FIG. 7 is a block/flow diagram illustrating a PnR flow when a violationof a design rule is detected, in accordance with an embodiment of thepresent invention.

At block 402, a place and route tool is employed to add the skip vias,each skip via extending through a metallization layer to electricallyconnect a metal layer above the metallization layer to a metal layerbelow the metallization layer.

At block 404, when a violation of a design rule is detected due to theaddition of one or more of the skip vias, skip vias that violate thedesign rule are substituted with a standard via.

The design flows of the exemplary embodiments can be a software programthat automates back end of the line (BEOL) wiring. Interconnectrequirements for the 7 nm technology node and beyond, driven byshrinking front end of the line (FEOL) geometry, push the limits of unitprocess tools for BEOL as well as FEOL. Lengthy and costly in-fabexperiments are needed to ensure that the integrated BEOL process meetslocal performance and cross-wafer uniformity requirements. Amodule-level approach can be employed to compensate for local andcross-wafer process variations of each unit process by makingadjustments elsewhere in the process flow, but such a strategy needs anexcessive amount of test wafer analysis to characterize the processinteractions. Virtual fabrication design flows conducted by theexemplary embodiments of the present invention allow for incorporationof skip vias into the virtual fabrication to reduce RC and to reduce theneed for minimum area wires.

Therefore, leading-edge semiconductor manufacturing requires theintegration of hundreds of process steps to fabricate transistors withincreasingly sophisticated 3D geometry. Greater process complexity has,in turn, dramatically increased the number of costly, time-consumingsilicon build-and-test learning cycles needed to bring new technologynodes to production. However, virtual fabrication can be employed toreduce or replace these learning cycles with predictive integratedprocess modeling advanced herein incorporating skip vias (or super vias)in the PnR flow designs.

FIG. 8 is an exemplary processing system for enabling the insertion ofone or more skip vias, in accordance with embodiments of the presentinvention.

The processing system includes at least one processor (CPU) 504operatively coupled to other components via a system bus 502. A cache506, a Read Only Memory (ROM) 508, a Random Access Memory (RAM) 510, aninput/output (I/O) adapter 520, a network adapter 530, a user interfaceadapter 540, and a display adapter 550, are operatively coupled to thesystem bus 502. Additionally, EDA software 601 is operatively coupled tothe system bus 502. The EDA software 601 adds the skips vias 611 in,e.g., the physical implementation phase 610.

A storage device 522 is operatively coupled to system bus 502 by the I/Oadapter 520. The storage device 522 can be any of a disk storage device(e.g., a magnetic or optical disk storage device), a solid statemagnetic device, and so forth.

A transceiver 532 is operatively coupled to system bus 502 by networkadapter 530.

User input devices 542 are operatively coupled to system bus 502 by userinterface adapter 540. The user input devices 542 can be any of akeyboard, a mouse, a keypad, an image capture device, a motion sensingdevice, a microphone, a device incorporating the functionality of atleast two of the preceding devices, and so forth. Of course, other typesof input devices can also be used, while maintaining the spirit of thepresent invention. The user input devices 542 can be the same type ofuser input device or different types of user input devices. The userinput devices 542 are used to input and output information to and fromthe processing system.

A display device 552 is operatively coupled to system bus 502 by displayadapter 550.

Of course, the skip via processing system may also include otherelements (not shown), as readily contemplated by one of skill in theart, as well as omit certain elements. For example, various other inputdevices and/or output devices can be included in the system, dependingupon the particular implementation of the same, as readily understood byone of ordinary skill in the art. For example, various types of wirelessand/or wired input and/or output devices can be used. Moreover,additional processors, controllers, memories, and so forth, in variousconfigurations can also be utilized as readily appreciated by one ofordinary skill in the art. These and other variations of the skip viaprocessing system are readily contemplated by one of ordinary skill inthe art given the teachings of the present invention provided herein.

FIG. 9 is a block/flow diagram of an exemplary system network whereusers access electronic design automation (EDA) tools to place one ormore skip vias, in accordance with embodiments of the present invention.

In system 700, a plurality of users 702 can access the EDA software 601to access a physical implementation tool 610 to place skip vias 611.

Throughout this specification, plural instances may implementcomponents, operations, or structures described as a single instance.Although individual operations of one or more methods are illustratedand described as separate operations, one or more of the individualoperations can be performed concurrently, and nothing requires that theoperations be performed in the order illustrated. Structures andfunctionality presented as separate components in example configurationscan be implemented as a combined structure or component. Similarly,structures and functionality presented as a single component can beimplemented as separate components. These and other variations,modifications, additions, and improvements fall within the scope of thesubject matter herein.

The various operations of example methods described herein, such asthose performed by the compiler, can be performed, at least partially,by one or more processors that are temporarily configured (e.g., bysoftware) or permanently configured to perform the relevant operations.Whether temporarily or permanently configured, such processors canconstitute processor-implemented modules that operate to perform one ormore operations or functions. The modules referred to herein can, insome example embodiments, comprise processor-implemented modules.

Similarly, the methods described herein can be at least partiallyprocessor-implemented. For example, at least some of the operations of amethod can be performed by one or processors or processor-implementedhardware modules. The performance of certain of the operations can bedistributed among the one or more processors, not only residing within asingle machine, but deployed across a number of machines. In someexample embodiments, the processor or processors can be located in asingle location (e.g., within a home environment, an office environmentor as a server farm), while in other embodiments the processors can bedistributed across a number of locations.

The one or more processors can also operate to support performance ofthe relevant operations in a “cloud computing” environment or as a“software as a service” (SaaS). For example, at least some of theoperations can be performed by a group of computers (as examples ofmachines including processors), these operations being accessible via anetwork (e.g., the Internet) and via one or more appropriate interfaces(e.g., application program interfaces (APIs).)

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments described. Manymodifications and variations will be apparent to those of ordinaryskills in the art without departing from the scope and spirit of thedescribed embodiments. The terminology used herein was chosen to bestexplain the one or more embodiments, the practical application ortechnical improvement over technologies found in the marketplace, or toenable others of ordinary skills in the art to understand theembodiments described herein.

The present invention can be a system, a method, and/or a computerprogram product. The computer program product can include a computerreadable storage medium (or media) having computer readable programinstructions thereon for causing a processor to carry out aspects of thepresent invention.

The computer readable storage medium can be a tangible device that canretain and store instructions for use by an instruction executiondevice. The computer readable storage medium can be, for example, but isnot limited to, an electronic storage device, a magnetic storage device,an optical storage device, an electromagnetic storage device, asemiconductor storage device, or any suitable combination of theforegoing. A non-exhaustive list of more specific examples of thecomputer readable storage medium includes the following: a portablecomputer diskette, a hard disk, a random access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), a static random access memory (SRAM), a portablecompact disc read-only memory (CD-ROM), a digital versatile disk (DVD),a memory stick, a floppy disk, a mechanically encoded device such aspunch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network can includecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

Computer readable program instructions for carrying out operations ofthe present invention can be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, or either source code or object code written in anycombination of one or more programming languages, including an objectoriented programming language such as Smalltalk, C++ or the like, andconventional procedural programming languages, such as the “C”programming language or similar programming languages. The computerreadable program instructions can execute entirely on the user'scomputer, partly on the user's computer, as a stand-alone softwarepackage, partly on the user's computer and partly on a remote computeror entirely on the remote computer or server. In the latter scenario,the remote computer can be connected to the user's computer through anytype of network, including a local area network (LAN) or a wide areanetwork (WAN), or the connection can be made to an external computer(for example, through the Internet using an Internet Service Provider).In some embodiments, electronic circuitry including, for example,programmable logic circuitry, field-programmable gate arrays (FPGA), orprogrammable logic arrays (PLA) can execute the computer readableprogram instructions by utilizing state information of the computerreadable program instructions to personalize the electronic circuitry,in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

These computer readable program instructions can be provided to at leastone processor of a general purpose computer, special purpose computer,or other programmable data processing apparatus to produce a machine,such that the instructions, which execute via the processor of thecomputer or other programmable data processing apparatus, create meansfor implementing the functions/acts specified in the flowchart and/orblock diagram block or blocks or modules. These computer readableprogram instructions can also be stored in a computer readable storagemedium that can direct a computer, a programmable data processingapparatus, and/or other devices to function in a particular manner, suchthat the computer readable storage medium having instructions storedtherein includes an article of manufacture including instructions whichimplement aspects of the function/act specified in the flowchart and/orblock diagram block or blocks or modules.

The computer readable program instructions can also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational blocks/steps to be performed on thecomputer, other programmable apparatus or other device to produce acomputer implemented process, such that the instructions which executeon the computer, other programmable apparatus, or other device implementthe functions/acts specified in the flowchart and/or block diagram blockor blocks or modules.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof instructions, which includes one or more executable instructions forimplementing the specified logical function(s). In some alternativeimplementations, the functions noted in the blocks may occur out of theorder noted in the figures. For example, two blocks shown in successionmay, in fact, be executed substantially concurrently, or the blocks maysometimes be executed in the reverse order, depending upon thefunctionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts or carry out combinations of special purpose hardwareand computer instructions.

Reference in the specification to “one embodiment” or “an embodiment” ofthe present principles, as well as other variations thereof, means thata particular feature, structure, characteristic, and so forth describedin connection with the embodiment is included in at least one embodimentof the present principles. Thus, the appearances of the phrase “in oneembodiment” or “in an embodiment”, as well any other variations,appearing in various places throughout the specification are notnecessarily all referring to the same embodiment.

It is to be appreciated that the use of any of the following “/”,“and/or”, and “at least one of”, for example, in the cases of “A/B”, “Aand/or B” and “at least one of A and B”, is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of both options (A andB). As a further example, in the cases of “A, B, and/or C” and “at leastone of A, B, and C”, such phrasing is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of the third listedoption (C) only, or the selection of the first and the second listedoptions (A and B) only, or the selection of the first and third listedoptions (A and C) only, or the selection of the second and third listedoptions (B and C) only, or the selection of all three options (A and Band C). This may be extended, as readily apparent by one of ordinaryskill in this and related arts, for as many items listed.

Having described preferred embodiments of a system and method forincorporating skip vias in a place and route flow of an integratedcircuit design (which are intended to be illustrative and not limiting),it is noted that modifications and variations can be made by personsskilled in the art in light of the above teachings. It is therefore tobe understood that changes may be made in the particular embodimentsdescribed which are within the scope of the invention as outlined by theappended claims. Having thus described aspects of the invention, withthe details and particularity required by the patent laws, what isclaimed and desired protected by Letters Patent is set forth in theappended claims.

What is claimed is:
 1. A method for incorporating skip vias in a placeand route flow of an integrated circuit design, the method comprising:employing a place and route tool to add the skip vias, each skip viaextending through a metallization layer to electrically connect a metallayer above the metallization layer to a metal layer below themetallization layer; and automatically adding the skip vias during theplace and route flow.
 2. The method of claim 1, further comprising, whena violation of a design rule is detected due to the addition of one ormore of the skip vias, substituting skip vias that violate the designrule with a standard via in a newly generated physical layout.
 3. Themethod of claim 1, further comprising adding the skip vias in alayer-by-layer fashion.
 4. The method of claim 1, further comprisinggenerating a list of failed skip vias.
 5. The method of claim 1, whereinthe place and route tool is a program that automates back end of theline (BEOL) wiring.
 6. The method of claim 1, wherein the design ruleincludes width rules and minimum space rules.
 7. The method of claim 1,wherein the skip vias enable reduction of resistance-capacitance (RC)and eliminate metallization layer minimum area.
 8. The method of claim1, wherein the skip vias enable automated design flow with balancedresistance-capacitance (RC) load among two metallization layers.
 9. Themethod of claim 1, wherein the place and route tool forms the skip viaswith nanometer scale dimensions.
 10. The method of claim 1, whereinusers can adjust placement of the automatically added skip vias based onfabrication design flows.
 11. A method for incorporating skip vias in aplace and route flow of an integrated circuit design, the methodcomprising: employing a place and route tool to add the skip vias, eachskip via extending through a metallization layer to electrically connecta metal layer above the metallization layer to a metal layer below themetallization layer; automatically adding the skip vias during the placeand route flow; and automatically aligning, in a vertical manner, themetal layer above the metallization layer to the metal layer below themetallization layer by the addition of the skip vias.
 12. The method ofclaim 11, further comprising, when a violation of a design rule isdetected due to the addition of one or more of the skip vias,substituting skip vias that violate the design rule with a standard viain a newly generated physical layout.
 13. The method of claim 11,further comprising adding the skip vias in a layer-by-layer fashion. 14.The method of claim 11, further comprising generating a list of failedskip vias.
 15. The method of claim 11, wherein the place and route toolis a program that automates back end of the line (BEOL) wiring.
 16. Themethod of claim 11, wherein the design rule includes width rules andminimum space rules.
 17. The method of claim 11, wherein the skip viasenable reduction of resistance-capacitance (RC) and eliminatemetallization layer minimum area.
 18. The method of claim 11, whereinthe skip vias enable automated design flow with balancedresistance-capacitance (RC) load among two metallization layers.
 19. Themethod of claim 11, wherein the place and route tool forms the skip viaswith nanometer scale dimensions.
 20. The method of claim 11, whereinusers can adjust placement of the automatically added skip vias based onfabrication design flows.